MBU4182 – Micro ATX Motherboard

  • Intel 10th Gen Xeon/Core™ with Intel® W480E
  • 4 DDR4 ECC/Non-ECC DIMM up to 128GB
  • Multiple expansion: 2 PCIe x16 (1 x16 or 2 x8 signal), 2 PCIe x4, 1 M.2 E key, 1 M.2 M key (support Optane Memory)
  • 3 independent displays: DP++, + VGA, + HDMI 1.4b
  • Rich I/O: up to 4 Intel GbE, 4 COM, 4 USB 3.2 Gen 2, 4 USB 3.2 Gen 1, 4 USB 2.0
  • 15-Year CPU Life Cycle Support until Q2 ‘34 (Based on Intel IOTG Roadmap)
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Specifications

SYSTEM PROCESSOR 10th Generation Intel® LGA 1200 Socket Processors, TDP support up to 125W
Intel® Xeon® W-1290E (10 Cores, 20M Cache, up to 4.8 GHz, ECC support); 95W
Intel® Xeon® W-1290TE (10 Cores, 20M Cache, up to 4.5 GHz, ECC support); 35W
Intel® Xeon® W-1270E (8 Cores, 16M Cache, up to 4.8 GHz, ECC support); 80W
Intel® Xeon® W-1270TE (8 Cores, 16M Cache, up to 4.4 GHz, ECC support); 35W
Intel® Xeon® W-1250E (6 Cores, 12M Cache, up to 4.7 GHz, ECC support); 80W
Intel® Xeon® W-1250TE (6 Cores, 12M Cache, up to 3.8 GHz, ECC support); 35W
Intel® Core™ i9-10900E (10 Cores, 20M Cache, up to 4.7 GHz); 65W
Intel® Core™ i9-10900TE (10 Cores, 20M Cache, up to 4.5 GHz); 35W
Intel® Core™ i7-10700E (8 Cores, 16M Cache, up to 4.5 GHz); 65W
Intel® Core™ i7-10700TE (8 Cores, 16M Cache, up to 4.4 GHz); 35W
Intel® Core™ i5-10500E (6 Cores, 12M Cache, up to 4.2 GHz); 65W
Intel® Core™ i5-10500TE (6 Cores, 12M Cache, up to 3.7 GHz); 35W
Intel® Core™ i3-10100E (4 Cores, 6M Cache, 3.8 GHz, ECC support); 65W
Intel® Core™ i3-10100TE (4 Cores, 6M Cache, to 3.6 GHz, ECC support); 35W
Intel® Pentium® G6400E (2 Cores, 4M Cache, 3.8 GHz); 58W
Intel® Pentium® G6400TE (2 Cores, 4M Cache, 3.2 GHz); 35W
Intel® Celeron® G5900E (2 Cores, 2M Cache, 3.2 GHz); 58W
Intel® Celeron® G5900TE (2 Cores, 2M Cache, 3.0 GHz); 35W
  CHIPSET Intel® W480E Chipset
  MEMORY Four 288-pin DIMM up to 128GB

Dual Channel DDR4 2400/2666/2933MHz (ECC/Non-ECC support)

  BIOS AMI SPI 128Mbit
GRAPHICS CONTROLLER Intel® HD Gen 9 Graphics
  FEATURE OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264,MPEG2,VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9
HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9
  DISPLAY 1 x DP++
1 x VGA
1 x HDMI 1.4b
DP++: resolution up to 4096×2106 @ 60Hz
VGA: resolution up to 1920×1200 @ 60Hz
HDMI resolution up to 4096×2160 @ 60Hz
  TRIPLE DISPLAYS DP++ + VGA + HDMI 1.4b
EXPANSION INTERFACE 2 x PCIe x16 (Gen 3) (1 x16 signals or 2 x8 signals)
2 x PCIe x4 (Gen 3)
1 x M.2 2230 E key (PCIe x1/USB2.0/Intel CNVi support)
1 x M.2 2242/2260/2280 M key (PCIe Gen3 x 4 NVMe/SATA/Intel Optane memory support)
AUDIO AUDIO CODEC Realtek ALC888
ETHERNET CONTROLLER 1 x Intel® i219LM PCIe (10/100/1000Mbps) (only Xeon, Core i9/i7/i5 support iAMT)

1 x Intel® i211AT PCIe (10/100/1000Mbps)

2 x Intel® i211AT PCIe (10/100/1000Mbps)

REAR I/O ETHERNET 4 x GbE (RJ-45)
  SERIAL N/A
  USB 2 x USB 3.2 Gen 2
4 x USB 3.2 Gen 1
  PS/2 N/A
  DISPLAY 1 x DP++

1 x VGA
1 x HDMI

  AUDIO 1 x Line-out, 1 x Mic-in, 1 x Line-in (Colay opt., MOQ required)
INTERNAL I/O SERIAL 2 x RS-232/422/485 (RS-232 w/ power) (2.54mm pitch)

2 x RS-232

  USB 4 x USB 2.0 (2.54mm pitch) (1 x USB 2.0 Colay vertical Type A)
2 x USB 3.2 Gen2
  AUDIO 1 x S/PDIF 1 x Front Audio Header
  SATA 4 x SATA 3.0

RAID 0/1/5/10

  DIO 1 x 8-bit DIO
  LPC 1 x LPC (supports LPC EXT-RS232/RS485 module)
  SMBUS 1 x SMBus
  OUTPUT & INTERVAL System Reset, Programmable via Software from 1 to 255 Seconds
  SECURITY TPM Infineon TPM2.0 (opt., MOQ required)
  TYPE ATX
  CONNECTOR 8-pin ATX 12V power

24-pin ATX power

  CONSUMPTION Typical: 9-10900K: 3.3V @ 0.41A (1.35W); 5V @ 0.76A (3.8W); 12V @ 0.34A (4.08W)

Max.: i9-10900K:3.3V @ 0.46A (1.52W); 5V @ 1.61A (8.05W); 12V @ 13.97A (167.64W)

  RTC BATTERY CR2032 Coin Cell
OS SUPPORT   Windows 10 Pro 64-bit

Windows 10 IoT Enterprise 64-bit

Linux

ENVIRONMENT TEMPERATURE Operating: -5 to 65°C
Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery
  HUMIDITY Operating: 5 to 90% RH

Storage: 5 to 90% RH

  MTBF 487,616 hrs @ 25°C; 271,110 hrs @ 40°C ; 303,603 hrs @ 45°C ; 168,586 hrs @ 60°C

Calculation Model: Telcordia Issue 4

Environment: GB, GC – Ground Benign, Controlled

MECHANICAL DIMENSIONS microATX Form Factor 244mm (9.6″) x 244mm (9.6″)
  HEIGHT PCB: 1.6mm / Top Side: TBD Bottom Side: TBD
CERTIFICATIONS   CE, RoHS

 

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