MBU4200 – Micro ATX Motherboard
- Intel 10th Gen Core™ with Intel® H420E
- 2 DDR4 DIMMs up to 64GB
- Multiple expansion: 1 PCIe x16, 1 PCIe x4, 2 PCI
- 2 independent displays: VGA, DP++, HDMI
- Rich I/O: 2 GbE, 6 COM, 4 USB 3.2, 2 USB 2.0
- 15-Year CPU Life Cycle Support until Q2 ‘34 (Based on Intel IOTG Roadmap)
Specifications
| SYSTEM | PROCESSOR | 10th Generation Intel® LGA 1200 Socket Processors, TDP support up to 125W
Intel® Core™ i9-10900E (10 Cores, 20M Cache, up to 4.7 GHz); 65W Intel® Core™ i9-10900TE (10 Cores, 20M Cache, up to 4.5 GHz); 35W Intel® Core™ i7-10700E (8 Cores, 16M Cache, up to 4.5 GHz); 65W Intel® Core™ i7-10700TE (8 Cores, 16M Cache, up to 4.4 GHz); 35W Intel® Core™ i5-10500E (6 Cores, 12M Cache, up to 4.2 GHz); 65W Intel® Core™ i5-10500TE (6 Cores, 12M Cache, up to 3.7 GHz); 35W Intel® Core™ i3-10100E (4 Cores, 6M Cache, 3.8 GHz); 65W Intel® Core™ i3-10100TE (4 Cores, 6M Cache, to 3.6 GHz); 35W Intel® Pentium® G6400E (2 Cores, 4M Cache, 3.8 GHz); 58W Intel® Pentium® G6400TE (2 Cores, 4M Cache, 3.2 GHz); 35W Intel® Celeron® G5900E (2 Cores, 2M Cache, 3.2 GHz); 58W Intel® Celeron® G5900TE (2 Cores, 2M Cache, 3.0 GHz); 35W |
| CHIPSET | Intel® H420E Chipset | |
| MEMORY | Two 288-pin Non-ECC UDIMM up to 64GB
Dual Channel DDR4 2400/2666/2933MHz |
|
| BIOS | Insyde SPI 256Mbit | |
| GRAPHICS | CONTROLLER | Intel® HD Gen 9 Graphics |
| FEATURE | OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9 HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9 |
|
| DISPLAY | 1 x VGA
1 x DP++ 1 x HDMI 1.4b VGA: resolution up to 1920×1200 @ 60Hz DP++: resolution up to 4096×2160 @ 60Hz HDMI: resolution up to 4096×2160 @ 24Hz |
|
| DUAL DISPLAYS | VGA + DP++ / VGA + HDMI / DP++ + HDMI | |
| EXPANSION | INTERFACE | 1 x PCIe x16 (Gen 3)
1 x PCIe x4 (Gen 3) 2 x PCI |
| AUDIO | AUDIO CODEC | Realtek ALC888 |
| ETHERNET | CONTROLLER | 1 x Intel® I211AT PCIe (10/100/1000Mbps)
1 x Intel® I219LM PHY with iAMT12.0 (10/100/1000Mbps) |
| REAR I/O | ETHERNET | 2 x GbE (RJ-45) |
| SERIAL | 1 x RS-232/422/485 (RS-232 w/ power) (DB-9) | |
| USB | 4 x USB 3.2 Gen1
2 x USB 2.0 |
|
| PS/2 | 1 x PS/2 (mini-DIN-6) | |
| DISPLAY | 1 x VGA
1 x DP++ 1 x HDMI |
|
| AUDIO | 1 x Line-out
1 x Mic-in 1 x Line-in (opt., MOQ required) |
|
| INTERNAL I/O | SERIAL | 5 x RS-232 (2.54mm pitch) (Up to 9 x RS-232, MOQ required) |
| USB | 2 x USB 3.2 Gen 1
2 x USB 2.0 (2.54mm pitch, Colay vertical Type A, opt.: MOQ required) |
|
| AUDIO | 1 x Front Audio Header
1 x S/PDIF |
|
| SATA | 4 x SATA 3.0 (up to 6Gb/s, SATA 3) | |
| DIO | 1 x 16-bit DIO | |
| LPC | 1 x LPC (supports LPC EXT-RS232/RS485 module) | |
| SMBUS | 1 x SMBus | |
| OUTPUT & INTERVAL | System Reset, Programmable via Software from 1 to 255 Seconds | |
| SECURITY TPM | Infineon TPM2.0 (opt., MOQ required) | |
| TYPE | ATX | |
| CONNECTOR | 8-pin ATX 12V power
24-pin ATX power |
|
| CONSUMPTION | Typical: i9-10900K: 3.3V @ 0.36A (1.19W); 5V @ 1.02A (5.1W); 12V @ 3.8A (45.6W)
Max.: i9-10900K:3.3V @ 0.38A (1.25W); 5V @ 1.82A (9.1W); 12V @ 15.64A (187.68W) |
|
| RTC BATTERY | CR2032 Coin Cell | |
| OS SUPPORT | Windows 10 Pro 64-bit
Windows 10 IoT Enterprise 64-bit Linux Ubuntu 20.04 |
|
| ENVIRONMENT | TEMPERATURE | Operating: -5 to 65°C Storage: -30 to 60°C with RTC Battery; -40 to 85°C without RTC Battery |
| HUMIDITY | Operating: 5 to 90% RH
Storage: 5 to 95% RH |
|
| MTBF | 534,071 hrs @ 25°C; 303,942 hrs @ 45°C ; 191,219 hrs @ 60°C ; 139,612 hrs @ 70°C
Calculation Model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled |
|
| MECHANICAL | DIMENSIONS | microATX Form Factor 244mm (9.6″) x 244mm (9.6″) |
| HEIGHT | PCB: 1.6mm / Top Side: 33mm; Bottom Side: 3mm | |
| CERTIFICATIONS | CE, FCC Class B, UKCA |
Downloads
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With a pan-European presence and offices in the UK and France, Industrial Computers specialises in the design and manufacture of Mission Critical Applied Computing Platforms. Serving markets including telecommunications, broadcast, military, industrial and medical, we work closely with our customers to conceive and manufacture the system their market and application requires.
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